SINGAPORE, ASMPT Ltd, a leading semiconductor and electronics assembly equipment manufacturer based in Singapore, is reporting sustained growth on the back of surging global demand for artificial intelligence (AI) infrastructure, positioning itself as a key enabler in the ongoing AI-driven digital transformation.
The company, formerly known as ASM Pacific Technology, has seen robust order momentum from chipmakers and data center operators as AI workloads — including large language models, computer vision, and real-time inference — drive demand for high-performance processors and advanced packaging technologies.
“Our business continues to benefit from strong structural tailwinds in AI adoption across cloud, automotive, and edge computing,” said Robin Ng, Group CEO of ASMPT. “The expansion of AI infrastructure globally is fuelling a new wave of investment in semiconductor backend equipment, and ASMPT is well-positioned to meet that demand.”
ASMPT’s advanced packaging and chip assembly solutions play a crucial role in enabling high-density, high-speed data processing. The firm specializes in hybrid bonding, system-in-package (SiP), and advanced thermal compression bonding — all essential for powering next-gen AI chips.
In its latest quarterly results, ASMPT reported a year-on-year revenue increase of 12%, with particularly strong performance in its Advanced Packaging Segment, which now accounts for nearly 40% of total sales. Profit margins also improved, aided by operational efficiencies and strong customer demand.
The company noted increased orders from global chipmakers looking to ramp up production of GPUs and AI accelerators, as well as networking chips for data centers. Major markets contributing to growth include the United States, Taiwan, South Korea, and increasingly, Southeast Asia.
“We’re seeing long-term investment cycles emerging from hyperscalers and chip foundries, and that bodes well for our business over the next 12 to 24 months,” Ng added.
ASMPT is also investing in R&D to support future growth. In 2024, it allocated over US$150 million toward research in heterogeneous integration, miniaturisation, and chiplet technologies — areas seen as critical to maintaining Moore’s Law and enabling AI at scale.
Analysts view ASMPT as a key beneficiary of the AI megatrend, especially as semiconductor firms shift focus from traditional nodes to more advanced packaging to overcome physical and performance limitations.
“ASMPT sits at the heart of the semiconductor backend ecosystem. Its deep expertise in advanced assembly processes gives it a competitive edge as AI workloads push demand for more compact, powerful, and thermally efficient chip solutions,” said a semiconductor analyst at DBS Group Research.
Looking ahead, ASMPT is expected to continue expanding its global footprint, with plans to strengthen its manufacturing and service capabilities in Malaysia and Vietnam to better support regional customers.
Despite ongoing geopolitical tensions and supply chain constraints, the company remains confident in its long-term prospects, pointing to a strong order book and healthy customer pipeline.
“The AI infrastructure boom is not just a flash in the pan — it’s a paradigm shift,” Ng said. “And ASMPT will be there to help build it.”
