KUALA LUMPUR, SP Setia Bhd, through its wholly-owned subsidiary Setia EcoHill Sdn Bhd, has entered into a joint venture with Japanese property investment company Mitsui Fudosan (Asia) Malaysia Sdn Bhd to develop a 113-acre residential project at the flagship township of Setia EcoHill in Semenyih, Selangor.
In a statement, SP Setia said the new joint venture company — Setia MF EcoHill Sdn Bhd — will oversee the development, which carries an estimated gross development value (GDV) of RM1.3bil. The upcoming project will comprise 683 units of bungalows, semi-detached, and cluster homes, designed to meet the growing demand for premium landed residences in the southern Klang Valley corridor. The first phase of the project is scheduled for launch in 2026.
SP Setia president and chief executive officer Datuk Zaini Yusoff said the collaboration marks a strategic milestone for the company and reflects its ongoing efforts to strengthen partnerships with reputable global developers.
“We are pleased to announce this pivotal collaboration with Mitsui Fudosan for our upcoming development in Setia EcoHill. This partnership combines SP Setia’s expertise in creating sustainable communities with Mitsui Fudosan’s global experience in innovative urban development. Together, we are confident this project will enhance Setia EcoHill’s overall profile and marketability among both local homebuyers and investors,” he said.
He added that SP Setia remains committed to accelerating its developments within the Semenyih and Bangi corridor, aligning with the group’s strategic landbank optimisation and long-term growth plans.
This marks the second collaboration between SP Setia and Mitsui Fudosan, following their partnership in the Setia Federal Hill development inked in December 2023.
Zaini noted that Mitsui Fudosan’s continued confidence in SP Setia demonstrates the strong synergy between the two companies, paving the way for future collaborations that bring together Malaysian market insights and Japanese innovation in design and community building.